MECHANICAL "UNIBODY" STIFFENER APPLIED TO HOT CHUCK WAFER PROBING
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2002-Jun-10
The increased use of bare die to obtain packaging efficiency has necessitated the development of wafer probe technologies to supply tested die for use in DCA (Direct Chip Attach) applications. Methods of wafer testing at elevated temperatures are being developed for die that will not be individ- ually packaged but instead used in DCA boards. Because these die will not be traditionally "final tested" at Hot-Cold-Ambient, they must be adequately stressed and tested during wafer probe. We have evaluated multiple probe card technologies at elevated temperatures for testing a wafer while it is being heated by a hot chuck in a wafer probing machine.