OPTIMIZATION OF WAFER RINSING
Original Publication Date: 1997-Sep-01
Included in the Prior Art Database: 2002-Jun-10
This work describes the experiments which have been done relating the amount of chemical remaining on the wafers with variables of the rinse such as temperature, flow rate, dump rinsing and the cycling of the rinse valves. We have found that the efftciency of water use can be improved by simply cycling the water flow on and off, with up to an order of magnitude less chemical remaining on the wafer with pulsing compared with the same amount of water used without pulsing. The reasons for this result are still being investigated.