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Method for a structure to add alignment posts to very fine pitch chip scale packages on printed circuit boards

IP.com Disclosure Number: IPCOM000008378D
Publication Date: 2002-Jun-11

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a structure to add alignment posts to very fine pitch chip scale packages (CSPs) on printed circuit boards (PCBs). Benefits include improved reliability and reduced defects.