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Bumpless Package with Backside Metallization

IP.com Disclosure Number: IPCOM000008381D
Publication Date: 2002-Jun-11

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for creating a bumpless buildup layer (BBUL) package in which dielectric layers are built up and patterned on one side, while metallization is deposited on both sides. The metal layers on the front side are patterned to form interconnection layers, while the back side is unpatterned and used for heat spreading. Benefits include better heat extraction and spreading by eliminating the first interface material.