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Method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery

IP.com Disclosure Number: IPCOM000008384D
Publication Date: 2002-Jun-11

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-cost substrate/package using an AlOx core, imprinted build-up layers, and surface mounted pins for power delivery. Benefits include improved performance and improved cost effectiveness.