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An approach to thin MMAP technology using bumpless build up

IP.com Disclosure Number: IPCOM000008385D
Publication Date: 2002-Jun-11
Document File: 4 page(s) / 102K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is an approach to thin mobility management application protocol (MMAP) technology using a bumpless build-up layer (BBUL) process. Benefits include improved functionality and improved reliability.