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Method for an inverted BGA package for stacking multichip modules

IP.com Disclosure Number: IPCOM000008388D
Publication Date: 2002-Jun-11
Document File: 5 page(s) / 117K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an inverted ball grid array (BGA) package for stacking multichip modules (MCMs). Benefits include improved functionality and improved reliability.