Publishing Venue
The IP.com Prior Art Database
Abstract
Disclosed is a method for a unified thermal mechanical heatsink. Benefits include simplified manufacturability.
Method for a unified thermal mechanical heatsink
Disclosed
is a method for a unified thermal mechanical heatsink. Benefits include
simplified manufacturability.
Background
Conventional solutions include a three-part system of a clip,
anchors, and a heatsink.
Description
The
disclosed method is a unified heatsink and mechanical stiffening solution (see
Figure 1). It is an SMT device rather than a through-hole device that combines
the clip, anchors, and heatsink as a single unit (see Figure 2).
The
manufacturing steps to produce the unit are as follows:
1. Stamp
the unit from sheet metal (see Figure 3).
a. Cut out the space for the die.
b. Cut for the support solution
formation.
c. Cut the tabs to form the box.
2. Fold
the tabs to form the box and weld the sides together (see Figure 4).
3. Form
the supports to create a rigid system that spans the length of the heatsink
package and a surface mount lead to solder the unit to the PCB (see Figure 1).
The
surface of the PCB includes the IC package and surface mount pads (see Figure
5).
Advantages
The disclosed
method provides advantages, including:
·
Simplified manufacturing due to being a single-point solution
·
Reduced cost
Fig. 1
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Fig.
2
Fig.
3
Fig. 4
Fig. 5
Disclosed anonymously