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The IP.com Prior Art Database
Disclosed is a method for a unified thermal mechanical heatsink. Benefits include simplified manufacturability.
United States
English (United States)
Method for a unified thermal mechanical heatsink
Disclosed is a method for a unified thermal mechanical heatsink. Benefits include simplified manufacturability.
Background
Conventional solutions include a three-part system of a clip, anchors, and a heatsink.
Description
The disclosed method is a unified heatsink and mechanical stiffening solution (see Figure 1). It is an SMT device rather than a through-hole device that combines the clip, anchors, and heatsink as a single unit (see Figure 2).
The manufacturing steps to produce the unit are as follows:
1. Stamp
the unit from sheet metal (see Figure 3).
a. Cut out the space for the die.
b. Cut for the support solution
formation.
c. Cut the tabs to form the box.
2. Fold the tabs to form the box and weld the sides together (see Figure 4).
3. Form the supports to create a rigid system that spans the length of the heatsink package and a surface mount lead to solder the unit to the PCB (see Figure 1).
The surface of the PCB includes the IC package and surface mount pads (see Figure 5).
Advantages
The disclosed method provides advantages, including:
· Simplified manufacturing due to being a single-point solution
· Reduced cost
Fig. 1
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Fig. 2
Fig. 3
Fig. 4
Fig. 5
Disclosed anonymously
