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Method for fabrication of a low cost and high performance imprinted multilayer substrate/package/board

IP.com Disclosure Number: IPCOM000008391D
Publication Date: 2002-Jun-11
Document File: 7 page(s) / 120K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for fabrication of a low cost and high performance imprinted multilayer substrate/package/board. Benefits include improved functionality, improved reliability, and simplified manufacturing process.