Browse Prior Art Database

INVERTED PCB HEAT SLUG/SINK FOR MICROELECTRONIC PACKAGES

IP.com Disclosure Number: IPCOM000008402D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-12

Publishing Venue

Motorola

Related People

Authors:
Bret A. Zahn

Abstract

Thermal characteristics of packaged semicon- utilize less space. Many traditional heat sinks are ductor devices have long been a major concern clipped or glued directly to the electronic packages for both manufacturers and users of electronic upper casing. These "clip-on" heat sinks dramatically products. Increased power dissipations, along with increase printed circuit board (pcb) profiles and do smaller integrated circuits and packages, require the not take full advantage of the board's ability to sink cost effective utilization of heat sinks or slugs heat, especially those boards which are thermally which are simple in design, light in weight, and enhanced.