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IP.com Disclosure Number: IPCOM000008406D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-12
Document File: 2 page(s) / 73K

Publishing Venue


Related People

William B. Mullen Kingshuk Banerji Alan Clayton


During the course of the development and manufacturing of circuit assemblies which utilize Ball Grid Array (BGA) technology, there are occa- sions when it becomes necessary to remove large quantities of these devices as part of a salvage oper- ation. Commercial equipment is currently available for this purpose, but carries with it a substantial capital cost, Often times salvage and repair opera- tions are not adequately funded to support the implementation of all the unique technologies needed to perform the special processes on the circuit assemblies, or the need to process large numbers of assemblies may cause excess utilization requirements to be focused on a BGA removal process. With the device described herein, the authors propose a tool specifically designed for low cost removal of BGA from the printed circuit boards. The device can be easily fabricated with minimal expense. As with most soldering devices, there are considerations for operator safety due to the temperatures needed to melt solder. But when handled properly this device is easy to deploy.