TOOL AND PROCESS FOR BALL GRID ARRAY (BGA) SOLDER JOINT FAILURE ANALYSIS
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-13
The examination of cracked solder joints in BGAs is difftcult since the joints are not directly visible as with leaded components, but rather are hidden beneath the carrier. Therefore, the BGA must be removed to analyze the solder joint fracture surfaces. Removing the BGA is a destructive proce- dure in which the chip and/or printed circuit board (PCB) is damaged and scrapped after analysis. The preservation of valuable solder joint analysis infor- mation during BGA removal, without destroying the component or printed circuit board, can be attained with this invention.