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TOOL AND PROCESS FOR BALL GRID ARRAY (BGA) SOLDER JOINT FAILURE ANALYSIS

IP.com Disclosure Number: IPCOM000008424D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-13
Document File: 3 page(s) / 124K

Publishing Venue

Motorola

Related People

Authors:
Joseph Gillette Kingshuk Banerji Edwin Bradley Jesse Galloway Pradeep Lall

Abstract

The examination of cracked solder joints in BGAs is difftcult since the joints are not directly visible as with leaded components, but rather are hidden beneath the carrier. Therefore, the BGA must be removed to analyze the solder joint fracture surfaces. Removing the BGA is a destructive proce- dure in which the chip and/or printed circuit board (PCB) is damaged and scrapped after analysis. The preservation of valuable solder joint analysis infor- mation during BGA removal, without destroying the component or printed circuit board, can be attained with this invention.