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Browse Prior Art Database

RE-DISTRIBUTION FOR FLIP CHIP

IP.com Disclosure Number: IPCOM000008444D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-14

Publishing Venue

Motorola

Related People

Authors:
Dwight Daniels Jeffrey Alan Miks

Abstract

Re-distribution of die pads, is used to re-distribute the fine pitch die pads out to a larger pitch for flip chip devices. Re-distribution can be constructed out of a number of various materials (e.g. low cost co-fired ceramic, flex circuitry, glass, thin-film organic laminates, etc. material). The re-distribution material discussed within, is a single layer, double sided substrate that re-distributes the die pads. Co-fired ceramic technology was initially selected because of its tine pitch pattern capability, but other materials may be used to accomplish the same results. The case example discussed within, is a co-fired ceramic substrate that re-distributes a IOOpm die pads pitch out to 5OOum solderball pitch (or greater), with standard technology for co-fired ceramic.