RE-DISTRIBUTION FOR FLIP CHIP
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-14
Re-distribution of die pads, is used to re-distribute the fine pitch die pads out to a larger pitch for flip chip devices. Re-distribution can be constructed out of a number of various materials (e.g. low cost co-fired ceramic, flex circuitry, glass, thin-film organic laminates, etc. material). The re-distribution material discussed within, is a single layer, double sided substrate that re-distributes the die pads. Co-fired ceramic technology was initially selected because of its tine pitch pattern capability, but other materials may be used to accomplish the same results. The case example discussed within, is a co-fired ceramic substrate that re-distributes a IOOpm die pads pitch out to 5OOum solderball pitch (or greater), with standard technology for co-fired ceramic.