SMART TESTING USING THE BDM FUNCTION OF THE MC 68XXX
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-14
New generations of products are getting smaller and smaller and there is not enough space on Printed Circuit Boards to accommodate conventional test pad nodes which are needed by In Circuit Test Equipment (ICT) to fully test the circuits. Also application specific integrated circuits (ASlCs) are far more difficult to test using conventional "Analog" ICT equipment due to the high integration and functions of these ASICs. Up to now the test coverage using ICT equipment has been directly related to the number of test pads available. With even higher product integration and the emergence of Ceramic hybrid products the full test access is getting harder to achieve. Also the digital compo- nent of the ASICs cannot be tested using standard analogue ICT equipment.