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Optimized Sputter Tool Magnet Configuration for Improving Wafer Film Uniformity and Sputter Target Utilization

IP.com Disclosure Number: IPCOM000008467D
Publication Date: 2002-Jun-17

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for improving wafer film uniformity and sputter target utilization by optimizing the sputter tool magnet configuration. Benefits include the elimination of erosion "profiles," or grooves, on the sputtering target.