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Disclosed is a method for a retention/attachment mechanism for an electronic package thermal solution. Benefits include improved thermal performance, improved throughput, and improved reliability.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately
50% of the total text.
Method for a retention/attachment mechanism for an
electronic package thermal solution
Disclosed is a method
for a retention/attachment mechanism for an electronic package thermal
solution. Benefits include improved thermal performance, improved throughput,
and improved reliability.
Conventionally, metal clips are used to snap a thermal
solution into place on an electronic package (see Figure 1). The clips ensure
the orientation and compressive load of the thermal interface material (TIM).
method is a spring-clip design and
assembly procedure for a thermal enhancement attachment to an electronic
package. The key elements include:
Spring-clip design that can be mounted to an
electronic package substrate using standard surface mount assembly processes
A design that enables the thermal solution to
be snapped onto the electronic package without a fixture or special tools
A flexible clip design (geometry) that enables
adjustable retention forces that translate into higher or lower TIM compressive
A design feature that enables the thermal
solution to be easily removed without special tools
The disclosed method provides
to quickly mount the thermal solution without fixtures
Clips that can
be surface mounted using standard surface mount processes on the front-of-line
Clips that can
be designed with varying spring rates through different tempering, materials,
or thickness to control thermal interface material compressive load