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Method of improving BGA joint yield and strength for SMD PCB pads

IP.com Disclosure Number: IPCOM000008472D
Publication Date: 2002-Jun-17
Document File: 6 page(s) / 334K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method of improving ball grid array (BGA) joint yield and strength for surface mounted device (SMD) printed circuit board (PCB) pads. Benefits include improved quality and improved reliability.