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Structures and Methods to Attach Ultra Thin Die to Printed Wiring Boards: 1)Using a Transparent Wafer and Heat Release Adhesive and 2) Using a Transparent Wafer and Photodegradable Adhesive Disclosure Number: IPCOM000008481D
Original Publication Date: 2002-Jun-17
Included in the Prior Art Database: 2002-Jun-17

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Related People

Krishna Kalyanasundaram Daniel Gamota Steven Scheifers Andrew Skipor


Lower semiconductor package thickness and less weight are among the significant benefits of using ultra-thin die. The methodology used today to assemble circuits with ultra-thin die is time and labor-intensive as well as costly. A high-volume-compatible IC structure for a microelectronic device enabling the attachment of thin die to substrates is proposed that addresses the aforementioned issues.