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An Alternate Via Plugging Apparatus for Printed Wire Boards

IP.com Disclosure Number: IPCOM000008482D
Publication Date: 2002-Jun-17
Document File: 2 page(s) / 33K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a partial cap during wave soldering to keep the connected BGA joint temperature below 165C. Benefits include the elimination of voids and shorts.