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Disclosed is a method that uses a partial cap during wave soldering to keep the connected BGA joint temperature below 165C. Benefits include the elimination of voids and shorts.
English (United States)
This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
An Alternate Via Plugging Apparatus for
Printed Wire Boards
Disclosed is a method that uses a partial cap during wave
soldering to keep the connected BGA joint temperature below 165C. Benefits
include the elimination of voids and shorts.
Currently, no cap is used on the backside of the BGA joint;
while this approach creates a good joint, it does not work with motherboards
that must pass through wave soldering. With standard BGA via in pad processing,
the joint formed on the via is capped with a solder mask (or other material)
that tends to outgas in reflow. This leads to voids, and in the worst case,
The disclosed method uses a partial cap to keep the
connected BGA joint temperature below 165C. This cap has a hole in its center,
providing thermal protection as well as consistent joint standoff through
venting. The vent can be constructed in many ways. Figure 1 shows four or more
joints formed with materials that do not melt in reflow; these provide BGA
joint standoff height control.
The disclosed method eliminates voids and shorts in the BGA
via in pad processing, and