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A Printed Circuit Manufacturing Method for Placing MLP Devices

IP.com Disclosure Number: IPCOM000008484D
Publication Date: 2002-Jun-17
Document File: 3 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that introduces a fiducal and a gas channel to the process of attaching an MLP , Micro Leadframe Package to a PCBA. Benefits include a reduction in placement and shorting issues associated with placing MLP devices.