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Serpentine Heat Sink Design

IP.com Disclosure Number: IPCOM000008485D
Publication Date: 2002-Jun-17
Document File: 3 page(s) / 289K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a new heat sink design that enables thermal dissipation on chips. The new design improves thermal dissipation while retaining a small form factor.