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INCREASING SURFACE MOUNT MOSFET POWER DISSIPATION THROUGH INNOVATIVE PC BOARD PATTERN DESIGNS

IP.com Disclosure Number: IPCOM000008500D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-18

Publishing Venue

Motorola

Related People

Authors:
Chandler Wade Kenneth Sias

Abstract

The advent of surface mount packages has resulted in issues that relate to heat dissipation and power ratings. Unlike through hole components which can rely on elevated heat sinks or chassis mounting for cooling, surface mount components require the designer to invent new methods of dissi- pation heat. This report investigates various methods of dissipating heat from surface mount components in free air on standard FR4 boards. The revolutionary methods discussed can increase power ratings by as much as 109%.