A HEAT TRANSFER ENHANCEMENT METHOD FOR FORCED CONVECTION BONDED-FIN HEATSINKS
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-18
Various types of heatsinks can be used in elec- tronic packaging to keep circuit elements cool by effectively transporting dissipated heat to a cooling fluid; e.g., the ambient air. A bonded-fin heatsink is comprised of a die-cast, extruded or machined backplane which includes long, parallel grooves into which plate fins are inserted and bonded using an adhesive. The convective heat loss from the exposed surfaces of a heatsink to the cooling fluid is quantified according to q" = h-AT (1) where q" is the heat flux from the surfaces, h is the convective heat transfer coefficient and AT is the temperature difference between the surfaces and the fluid. It is apparent in Equation 1 that for a given heat flux (thermal load), AT will be reduced if h is increased. By reducing the temperature difference between the heatsink and the cooling fluid, the electronic components will operate at a lower temperature, resulting in a more reliable product overall. The basic problem to be addressed with this invention is the maximization of the con- vective heat loss from heat sink surfaces by modifi- cation of tin geometry to provide greater convective heat transfer coefficient values.