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Browse Prior Art Database

DISPENSED INTERCONNECTION BUMPS FOR SEMICONDUCTOR DEVICES

IP.com Disclosure Number: IPCOM000008515D
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-19
Document File: 3 page(s) / 143K

Publishing Venue

Motorola

Related People

Authors:
David Clegg Jeff Jones Gordon Wesley

Abstract

There are many means by which semiconductor devices are electrically connected to the outside wor!d. Typically, the "first level" of this connection scheme usually takes the form of a semiconductor "package." A first level package most commonly consists of a semiconductor device bonded electri- cally and mechanically to a larger substrate with some integral type of external electrical contacts routing back to the semiconductor. This first level package is then in-turn mounted on a larger printed circuit board for its end-use application.