DISPENSED INTERCONNECTION BUMPS FOR SEMICONDUCTOR DEVICES
Original Publication Date: 1997-Dec-01
Included in the Prior Art Database: 2002-Jun-19
There are many means by which semiconductor devices are electrically connected to the outside wor!d. Typically, the "first level" of this connection scheme usually takes the form of a semiconductor "package." A first level package most commonly consists of a semiconductor device bonded electri- cally and mechanically to a larger substrate with some integral type of external electrical contacts routing back to the semiconductor. This first level package is then in-turn mounted on a larger printed circuit board for its end-use application.