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Browse Prior Art Database

SNAP CURE CAPPING FIXTURE

IP.com Disclosure Number: IPCOM000008541D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-21

Publishing Venue

Motorola

Related People

Authors:
Huzainor Hamzah

Abstract

RFSOE products are encapped with a ceramic lid which is coated with epoxy sealing material on its lip. The encapsulation or capping process presently has several issues. Firstly, they are several types of epoxy which require several ways of capping method. Secondly, gross leak failure rate is quite high (-10%). Thirdly, several customers who use some of these products have been experiencing solder seepage during their solder reflow process, Solder seepage is where solder seeps through the epoxy and damages the device. A study on this issue has shown that the sealing strength of the epoxy is weakened when it is exposed to high solder fluid temperature. Finally, the RFSOE production line is moving towards automated processes where reduc- tion in process cycle time is one of the critical requirements. This will be very difficult to achieve with the current capping process.