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QUALIFICATION AND QUALITY ASSURANCE TEST AND COUPON FOR TQFP PACKAGES

IP.com Disclosure Number: IPCOM000008544D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-21
Document File: 4 page(s) / 227K

Publishing Venue

Motorola

Related People

Authors:
Pradeep Lall Edwin Bradley

Abstract

A new test board has been devised for the quality assurance and qualification of solder joints in TSOP and TQFP packages. The test board configuration uses the conventional lnstron pull test to concen- trate the test load in the solder joints and thus pref- erentially tests the quality of the solder connections.