Browse Prior Art Database

SLURRY SUPPLY SYSTEM DESIGN FOR CHEMICAL MECHANICAL POLISHING

IP.com Disclosure Number: IPCOM000008583D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-25

Publishing Venue

Motorola

Related People

Authors:
Daniel A. Koos Randy McClamrock Paul Bajnoczy

Abstract

Slurries used for Chemical Mechanical Polishing (CMP) are typically a colloidal suspen- sion of an abrasive and a chemical oxidant. In the ideal case the slurry is a homogenous mixture of suspended particles with a well defined particle size distribution. The slurry is supplied to the polisher from a supply drum via a distribution system con- sisting of a day tank, supply lines and associated hardware. The distribution system typically has a separate controller with associated software and communication links to the polisher.