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EPS Inner Core Metal Layers and Cavity Plating Design for the Embedded Capacitor Substrate

IP.com Disclosure Number: IPCOM000008589D
Publication Date: 2002-Jun-25

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for modifying the current EPS design by adding metal layers and cavity plating to the center core of the EPS structure. Benefits include reduced inductance of the electrical path from the capacitor to the die.