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Method for symmetrical dual-sided multi-pack systems board assembly on a single SMT manufacturing line

IP.com Disclosure Number: IPCOM000008593D
Publication Date: 2002-Jun-25
Document File: 4 page(s) / 426K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for symmetrical dual-sided multi-pack systems board assembly on a single surface-mount technology (SMT) manufacturing line. Benefits include improved manufacturing simplicity and improved product reliability.