Dismiss
InnovationQ and the IP.com Prior Art Database will be updated on Sunday, December 15, from 11am-2pm ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Method for symmetrical dual-sided multi-pack systems board assembly on a single SMT manufacturing line

IP.com Disclosure Number: IPCOM000008593D
Publication Date: 2002-Jun-25

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for symmetrical dual-sided multi-pack systems board assembly on a single surface-mount technology (SMT) manufacturing line. Benefits include improved manufacturing simplicity and improved product reliability.