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Method for direct chip attachment using die back-side power delivery and through-silicon vias

IP.com Disclosure Number: IPCOM000008596D
Publication Date: 2002-Jun-25

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for direct chip attachment (DCA) using die back-side power delivery and through-silicon vias. Benefits include the elimination of high-cost package substrates.