Enhancing BiStatix Bare Die Assembly Yield Using an Additional Ink Layer
Original Publication Date: 2002-Jun-25
Included in the Prior Art Database: 2002-Jun-25
Attaching a bare die to the ink/paper based BiStatix substrate is a cost effective alternative to the current bumped die process. The elimination of both the conductive polymer bump as well as the die dielectric, as shown in Figure 1., yields a more cost effective alternative to the current design.