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SEMI-PIERCE PLATE FOR ALIGNMENT OF SOLDER PREFORM AND DBC CERAMICS

IP.com Disclosure Number: IPCOM000008617D
Original Publication Date: 1998-Mar-01
Included in the Prior Art Database: 2002-Jun-27

Publishing Venue

Motorola

Related People

Authors:
Pablo Rodriguez

Abstract

The construction of power modules requires an isolation layer to a!low desired circuitry to be inte- grated directly in the module. While the layer may be required to maintain high voltage isolation, a highly thermally conductive path is crucial for the thermal management of the devices. In high power modules, such an isolation layer is typically constructed using direct bonded copper ceramics (DBC). A ceramic is directly sandwiched in copper layers; the top copper layer is etched to provide the desired circuitry while the bottom layer is used to subsequently solder the ceramic to a base plate.