HIGH HOLDING FORCE PLATFORM LIFT
Original Publication Date: 1998-Jun-01
Included in the Prior Art Database: 2002-Jul-09
The lift platform sits below the substrate level while a film is advancing on the line, as shown in Figure 1. When indexing procedure is completed the lift plate is raised to tnakc contact with the film by simultaneously activating four cams. At this point a high force end-effector of the bonder comes down to attach the chip to the flex film. The bonder applies pressure and heat to the top of the die to achieve a reliable bond. This pressure is transferred through the chip, flex and to the lift platform. After the bond occurs the cycle starts over.