Defensive Publication for A Low Cost Thermal Ball Grid Array Package (LCTBGA)
Original Publication Date: 2002-Jul-10
Included in the Prior Art Database: 2002-Jul-10
Currently there is a large price difference for high pin count packaging solutions that can dissipate 2.5 to 3 watts of power in a closed environment that allows for a temperature difference of 50C. The two most common solutions, targeted for this thermal performance range, include the Thermally Enhanced Plastic Ball Grid Array (TEPBGA) and the Tape Ball Grid Array (TBGA), which often can have a cost difference of 100% or more. This cost gap in combination with a number of other issues with these solutions have led to several investigations of alternative low cost thermal packaging solutions within Motorola. This defensive publication will discuss one such solution and the method for assembly that has been shown to be considerably less expensive than current open market solutions and is relatively easily integrated into a standard plastic ball grid array assembly process. Further perceived benefits of this packaging solution include improved MSL performance and lower package profile.