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Browse Prior Art Database

Method to incorporate low-k liquid dielectrics between metallic interconnects for insulating and cooling microelectronic devices

IP.com Disclosure Number: IPCOM000008794D
Publication Date: 2002-Jul-12

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to incorporate low dielectric-constant (k) liquid dielectrics between metallic interconnects for insulating and cooling microelectronic devices. Benefits include improved manufacturability and improved performance.