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Method to form air gaps between copper interconnect lines by dissolving in a solvent a sacrificial solid that may or may not be a dielectric

IP.com Disclosure Number: IPCOM000008795D
Publication Date: 2002-Jul-12
Document File: 3 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to form air gaps between copper interconnect lines by dissolving in a solvent a sacrificial solid that may or may not be a dielectric. Benefits include improved functionality.