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TWO STEP ENCAPSULATION PROCESS FOR IMPROVING YIELD ON PLASTIC PACKAGES

IP.com Disclosure Number: IPCOM000008829D
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-17

Publishing Venue

Motorola

Related People

Authors:
E. W. Mace R. A. Munroe

Abstract

The shrinking of integrated circuit semiconductor devices has resulted in decreasing wire bond pitch and greater numbers of wire bonds. This general trend has made molding of plastic packages increasingly difficult and in some cases economically unfeasible. The prob- lem is typically one of wire shorting or movement which is unacceptable from an electrical or quality viewpoint. The end result is a poor assembly yield.