Browse Prior Art Database

LEAD ON CHIP TAPE ADHESIVE STRENGTH TESTER

IP.com Disclosure Number: IPCOM000008830D
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-17

Publishing Venue

Motorola

Related People

Authors:
Wh Chan Caron Kee Tze Ping

Abstract

A conventional die shear tester is not capable of measuring die shear strength effectively for lead on chip (LOC) devices. To determine the adhesive strength between the die to LOC tape interface, an adhesive strength tester was developed by modifying the conventional die shear tester. Conventionally, a manual hand peel method was used to determine the tape adhesion quality. This method of testing is not quantifiable, produces reliable results, and has large variation when different operators perform the peeling. The development of this tape adhesive strength tester provides a means of quantifying the tape adhesion quality for in line monitoring, and also serves as a reli- able tool for process characterization.