SOLDERING PROCESS IMPROVEMENT

Publishing Venue

Motorola

Related People

Abstract

This concerns the improvement of a soldering process for mechanical components having electri- cal capacity discharge, in particular metallic covers on a metallic baseplate. This process is used, for example, to produce electronic regulators for alter- nators.

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MOTOROLA Technical Deve1opment.s

SOLDERING PROCESS IMPROVEMENT

by Olivier Bouillet and Gabriel Fouchereau

  This concerns the improvement of a soldering process for mechanical components having electri- cal capacity discharge, in particular metallic covers on a metallic baseplate. This process is used, for example, to produce electronic regulators for alter- nators.

This soldering process of a cover on a nickel steel baseplate consists of:

  Applying a force between the two parts to be assembled in order to obtain a smooth electrical resistance between the elements to be soldered.

Releasing the electrical energy between the mechanical components to perform the soldering.

  The mechanical elements soldered by this process often suffer from an irregular solder quality in the assembling area. This irregularity is due 'to a parallelism defect between the soldering electrodes as shown in Figure 1.

  The solder electric intensity in the part to be sol- dered is irregular if the parallelism of the mechani- cal parts to solder is incorrect.

Fig. 1 New/Modern System To Counteract A Parallelism Problem

0 h4o<oKh. 1°C. 1998 114 September ~1998

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MOTOROLA Technical Developments

  The improvement consists of putting in place an additional mechanical function, namely a sprung member, that will guarantee a regular distribution of the mechanical effort in the soldering area. as shown in Figure 2. The soldering el...