SERIGRAPHY PROCESS IMPROVEMENT
Original Publication Date: 1998-Sep-01
Included in the Prior Art Database: 2002-Jul-18
This concerns an improvement in a serigraphy process used to dispense solder paste on a PCB (Printed Circuit Board). The solder paste is manual- ly placed along a scraper. The paste is introduced in the openings of the serigraphy screen and thus, is deposited on the PCB through the moving scrapes (Figure I).