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Method for high-speed ball-pull metrology for testing the strength of solder joints

IP.com Disclosure Number: IPCOM000008884D
Publication Date: 2002-Jul-19

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a high-speed ball-pull metrology that tests the strength of a solder-joint interconnect. Benefits include improved functionality and performance of solder-to-component strength testing, and improved product mechanical robustness, high-yield and high-quality production.