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Method for low stress, high yield plated-through-hole designs in metal core flip-chip microelectronic packages

IP.com Disclosure Number: IPCOM000008898D
Publication Date: 2002-Jul-22

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for low stress, high yield plated-through-hole (PTH) designs in metal core flip-chip microelectronic packages. Benefits include improved reliability.