WAFER FRAME DEVELOPMENT FOR TWO-DIRECTIONAL WAFER LOADING IN X-CELL DIE BONDING
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-23
Because of the acceleration sensing die char- acteristics, X-lateral accelerometer wafer is fabri- cated with the crossed mask unlike other general wafer (shown in Figure 1) during its manufacturing process. The current die bond machine in X-lateral was designed for picking and bonding the general pattern die not the crossed (reversed) pattern die.