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Method for a uniform Cu line at the scribe line to prevent cracks caused during wafer thinning in vertically stacked wafer technology

IP.com Disclosure Number: IPCOM000008914D
Publication Date: 2002-Jul-23

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a uniform Cu line at the scribe line to prevent cracks caused during wafer thinning in vertically stacked wafer technology. Benefits include improved reliability.