Browse Prior Art Database

HIGH CONTRAST SOLDER PASTE

IP.com Disclosure Number: IPCOM000008918D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-24

Publishing Venue

Motorola

Related People

Authors:
Martin Mason

Abstract

Solder Paste printing is one of the basic process- es which is used to assemble Printed Circuit Board assemblies. This takes the form of a screen-printing process using a metal screen and solder in the form of a paste. The solder paste is a complex formula- tion made from tiny spheres of a eutectic mix of tin and lead which is combined with fluxes and solvents to produce a thick gray paste suitable for the screen print process.