BALL GRID ARRAY AND CHIP SCALE PACKAGE PAD GEOMETRY WITH INTEGRATED COMPONENT FIDUCIALS
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-24
This paper describes how, by integrating the The proposed solution relies on the two corner component placement fiducial, components can be pads, which are under the most stress and are there- placed more economically with respect to printed fore seldom used, being altered in shape as shown in circuit board real estate. Figure 3, Page 5.5.