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BALL GRID ARRAY AND CHIP SCALE PACKAGE PAD GEOMETRY WITH INTEGRATED COMPONENT FIDUCIALS

IP.com Disclosure Number: IPCOM000008923D
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-24

Publishing Venue

Motorola

Related People

Authors:
Ian Shute Brian Cosgave

Abstract

This paper describes how, by integrating the The proposed solution relies on the two corner component placement fiducial, components can be pads, which are under the most stress and are there- placed more economically with respect to printed fore seldom used, being altered in shape as shown in circuit board real estate. Figure 3, Page 5.5.