TESTING OF BALL GRID ARRAYS (BGAS)
Original Publication Date: 1999-Jan-01
Included in the Prior Art Database: 2002-Jul-25
Ball grid arrays (BGAs) that are packaged for commercial applications can be ceramic capped or globbed. Each of these BGAs typically has a sub- strate that supports multiple circuit layers. Conventionally, vias for connecting these layers are located on the sides of the substrate and are masked, therefore testing I probing of these BGAs when mounted is almost impossible.