Method for a high-density cap
Publication Date: 2002-Jul-26
Publishing Venue
The IP.com Prior Art Database
Abstract
Disclosed is a method for a high-density cap. Benefits include improved capacitance.
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The IP.com Prior Art Database
Disclosed is a method for a high-density cap. Benefits include improved capacitance.
United States
English (United States)
Method for a high-density cap
Disclosed is a method for a high-density cap. Benefits include improved capacitance.
Background
A requirement exists to improve the capacitance value of a cap for a given case size. The conventional solutions are to use a larger capacitor case size or increase the number of electrodes (see Figure 1).
General description
The disclosed method is a design to increase the capacitance density of a cap for a given case size. The key element of the method is to use a nonflat electrode surface design to increase the total surface area of electrode plates, increasing the capacitance of the part (see Figure 2).
Advantages
The disclosed method provides advantages, including:
· Improved (smaller) case size capacitor to achieve the same capacitor value
· Improved capacitance value of a cap for a given case size by increasing the total surface area of the electrodes
Detailed description
The disclosed method is a design that increases the capacitance density of a cap. The process to produce the disclosed method is comprised of the following steps:
1. The first dielectric layer is etched using mechanical or chemical etching to create hills and valleys (main feature of this design to increase overall surface area).
2. Electro-deposition or the vapor deposition method places a thin layer of electrode on the dielectric.
3. If baking is required, it is done at this stage
4. Via formation, option 1: Vias are created as each cap layer is built using either mechanical...