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Method for using a vacuum seal to mechanically couple a chassis to a motherboard

IP.com Disclosure Number: IPCOM000008969D
Publication Date: 2002-Jul-26
Document File: 7 page(s) / 61K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for using a vacuum seal to mechanically couple a chassis to a motherboard. Benefits include improved reliability.