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Method for a microprocessor package with lossy polymer gel-filled IHS cavity and lossy polymer dam around a silicon die

IP.com Disclosure Number: IPCOM000008972D
Publication Date: 2002-Jul-26

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a microprocessor package with lossy polymer gel-filled IHS cavity and lossy polymer dam around a silicon die. Benefits include improved signal quality and improved thermal performance.